CN159 NS is a Bisphenol A epoxy methacrylate oligomer. Heat resistance, hardness, and chemical resistance highlight a list of features which combine to make it a high utility product. This oligomer will cure more slowly than the acrylate equivalent. CN159 NS is recommended for use in electronic solder masks, potting compounds, composites, or any application where high temperature resistance and hardness are needed. Stereolithography and wood and metal coatings are additional applications where CN159 NS has shown utility.
The document has been added to your favorites
You can add your own notes to this document
Related market & applications
3D Printing / Additive Manufacturing
Adhesives & Sealants
Coatings & Inks
Composites & Advanced Materials
Electrical & Electronics
Chemicals For Electronic
Share this page
This website no longer supports your web browser (Internet Explorer). Please try the latest version of one of these web browsers: Chrome, Firefox, Safari, or Microsoft Edge.